Qualcomm Off-Campus Drive 2023 for the post of DSP Firmware Engineer. Students from various disciplines can apply for Qualcomm Recruitment 2023. The detailed eligibility, Requirements, Salary, and application process are given below.

About Company:  Qualcomm is an American multinational information technology services and consulting company. It is headquartered in Teaneck, New Jersey, United States. 

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Qualcomm Off-Campus Drive 2023:

Organization Qualcomm
Job Title DSP Firmware Engineer
Salary 8 LPA (Expected)
Location Hyderabad
Job Type Full time
Experience 0 – 2 Years
Batch 18/19/20/21/22/2023

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Job Description:

  • Contributes to hardware conceptualization and choices for optimal performance
  • Works closely with the Layer 1 protocol engineers to design protocolcompliant state machines to control the hardware
  • Collaborates closely with hardware, systems and test engineers during all cycles of product development
  • Designs in new features to keep Qualcomm chips competitive in an ever-evolving marketplace
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    • Are adept at C-programming and can develop real-time embedded software for proprietary DSPs
    • Understand capabilities of hardware blocks like codecs, RFICs and their interfaces with software
    • Appreciate 3GPP/IEEE spec requirements to develop drivers that program the hardware for 2G through 5G and for WLAN PHY
    • Develop signal processing algorithms which are essential for modem performance
    • Possess knowledge of Digital Signal Processing Concepts Digital Communications Theory/C and MATLAB programming


    • Bachelor’s/Master’s Degree in EE/ECE

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    How to Apply for Qualcomm Off Campus Drive 2023?

    Interested and Eligible candidates can apply for this drive online by using the link below.

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